Kokusai Electric

Kokusai Electric Corporation

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EQUIPMENT🇯🇵 JPChokepoint6525 · TSE
kokusai-electric.com

Market Share

~40% batch ALD/CVD furnaces (dominant for NAND/DRAM)

Key Product

Batch thermal ALD and CVD furnace systems

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Kokusai Electric Corporation (TSE: 6525) was spun out of Hitachi Kokusai Electric in 2018, acquired by KKR in 2019, and re-listed on the Tokyo Stock Exchange in 2023 — a trajectory that reflects both the strategic value of its technology and the consolidation of Japan's semiconductor equipment sector. The company specializes in batch thermal processing equipment: vertical diffusion furnaces, batch ALD (atomic layer deposition) systems, and batch CVD (chemical vapor deposition) furnaces. Unlike single-wafer tools (which process one wafer at a time in a reaction chamber), batch furnaces process 25–100 wafers simultaneously in a vertical quartz tube, achieving extremely uniform film deposition at low cost per wafer. Batch furnace tools are essential for depositing the thin oxide, nitride, and high-k dielectric layers that form the cell structure of NAND flash and the capacitor dielectrics in DRAM. As NAND layer counts have escalated from 64L to 176L to 232L and beyond, the number of ALD/CVD steps per wafer has grown proportionally — increasing Kokusai's revenue per device generation. The same dynamics apply to DRAM as the industry migrates to DDR5 and HBM. Kokusai Electric's customer base spans SK Hynix, Samsung Memory, Micron, YMTC, and CXMT. Its presence at Chinese memory fabs made it subject to US export control reviews in 2023, as the BIS considered whether batch furnace tools require an Entity List license for supply to Yangtze Memory Technologies (YMTC). The company has navigated these restrictions carefully, maintaining some legacy supply while curtailing next-generation tooling. The company competes primarily with TEL and Applied Materials in the furnace space, but holds a particularly strong position in vertical batch ALD — a niche where switching costs are high due to deep integration with each customer's process recipes.

Critical path — raw silicon to deployment

EQUIPMENT

Kokusai Electric

Batch thermal ALD and CVD furnace systems

FOUNDRIES

TSMC

CoWoS advanced packaging, N3/N2 logic

FOUNDRIES

UMC

28nm HKMG, 40nm, specialty process nodes

Export controls touching Kokusai Electric