Japan Semiconductor Equipment Export Controls (Jul 2023)
Japan's Ministry of Economy, Trade and Industry imposed export licensing requirements on 23 categories of advanced semiconductor manufacturing equipment, effective July 2023. The rules cover tools used in cutting-edge lithography, etching, deposition, and inspection — directly affecting major Japanese suppliers such as Tokyo Electron, Shin-Etsu Chemical, and Lasertec. Coordinated with U.S. and Dutch controls, this closed the last significant allied gap in restricting China's access to leading-edge chip production equipment.
2
Companies cut off
5
At-risk downstream
2
Tiers in cascade
4
Chokepoint links severed
Company Cascade
| Status | Company | Layer | Country |
|---|---|---|---|
| ⛔ Cut off | CXMT | MEMORY (HBM) | 🇨🇳 CN |
| ⛔ Cut off | YMTC | MEMORY (HBM) | 🇨🇳 CN |
| ⚠ At risk | Alibaba Cloud | CLOUD PROVIDERS | 🇨🇳 CN |
| ⚠ At risk | Baidu | CLOUD PROVIDERS | 🇨🇳 CN |
| ⚠ At risk | ByteDance | CLOUD PROVIDERS | 🇨🇳 CN |
| ⚠ At risk | Huawei Cloud | CLOUD PROVIDERS | 🇨🇳 CN |
| ⚠ At risk | Tencent Cloud | CLOUD PROVIDERS | 🇨🇳 CN |
⛔ Cut offCXMT
MEMORY (HBM)🇨🇳 CN
⛔ Cut offYMTC
MEMORY (HBM)🇨🇳 CN
⚠ At riskAlibaba Cloud
CLOUD PROVIDERS🇨🇳 CN
⚠ At riskBaidu
CLOUD PROVIDERS🇨🇳 CN
⚠ At riskByteDance
CLOUD PROVIDERS🇨🇳 CN
⚠ At riskHuawei Cloud
CLOUD PROVIDERS🇨🇳 CN
⚠ At riskTencent Cloud
CLOUD PROVIDERS🇨🇳 CN
✓ 6666 unaffected companies (shown for context)▾
| Status | Company | Layer | Country |
|---|---|---|---|
| ✓ Unaffected | AMD | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | Amkor Technology | OSAT / PACKAGING | 🇺🇸 US |
| ✓ Unaffected | Anthropic | AI CONSUMERS | 🇺🇸 US |
| ✓ Unaffected | Apple | EDGE DEVICES | 🇺🇸 US |
| ✓ Unaffected | Applied Materials | EQUIPMENT | 🇺🇸 US |
| ✓ Unaffected | Arista Networks | NETWORKING | 🇺🇸 US |
| ✓ Unaffected | Arm Holdings | CHIP IP | 🇬🇧 GB |
| ✓ Unaffected | ASE Technology | OSAT / PACKAGING | 🇹🇼 TW |
| ✓ Unaffected | AWS | CLOUD PROVIDERS | 🇺🇸 US |
| ✓ Unaffected | Biren Technology | CHIP DESIGNERS | 🇨🇳 CN |
| ✓ Unaffected | Broadcom | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | Cadence | EDA TOOLS | 🇺🇸 US |
| ✓ Unaffected | Cambricon | CHIP DESIGNERS | 🇨🇳 CN |
| ✓ Unaffected | Cerebras Systems | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | Cisco Systems | NETWORKING | 🇺🇸 US |
| ✓ Unaffected | CoreWeave | CLOUD PROVIDERS | 🇺🇸 US |
| ✓ Unaffected | DeepSeek | AI CONSUMERS | 🇨🇳 CN |
| ✓ Unaffected | Dell Technologies | ENTERPRISE | 🇺🇸 US |
| ✓ Unaffected | Entegris | MATERIALS (JAPAN) | 🇺🇸 US |
| ✓ Unaffected | Foxconn FII | SERVER ODMs | 🇹🇼 TW |
| ✓ Unaffected | GlobalFoundries | FOUNDRIES | 🇺🇸 US |
| ✓ Unaffected | Google Cloud | CLOUD PROVIDERS | 🇺🇸 US |
| ✓ Unaffected | Groq | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | High-Purity Quartz (US) | RAW MATERIALS | 🇺🇸 US |
| ✓ Unaffected | Huawei / HiSilicon | CHIP DESIGNERS | 🇨🇳 CN |
| ✓ Unaffected | Ibiden | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | Intel | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | Intel Foundry | FOUNDRIES | 🇺🇸 US |
| ✓ Unaffected | JSR Corporation | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | KLA | EQUIPMENT | 🇺🇸 US |
| ✓ Unaffected | Kokusai Electric | EQUIPMENT | 🇯🇵 JP |
| ✓ Unaffected | Lam Research | EQUIPMENT | 🇺🇸 US |
| ✓ Unaffected | Marvell | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | MediaTek | CHIP DESIGNERS | 🇹🇼 TW |
| ✓ Unaffected | Meta | AI CONSUMERS | 🇺🇸 US |
| ✓ Unaffected | Micron | MEMORY (HBM) | 🇺🇸 US |
| ✓ Unaffected | Microsoft Azure | CLOUD PROVIDERS | 🇺🇸 US |
| ✓ Unaffected | Mistral AI | AI CONSUMERS | 🇫🇷 FR |
| ✓ Unaffected | NTT | CLOUD PROVIDERS | 🇯🇵 JP |
| ✓ Unaffected | NVIDIA | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | OpenAI | AI CONSUMERS | 🇺🇸 US |
| ✓ Unaffected | OPPO | EDGE DEVICES | 🇨🇳 CN |
| ✓ Unaffected | Oracle Cloud | CLOUD PROVIDERS | 🇺🇸 US |
| ✓ Unaffected | Qualcomm | CHIP DESIGNERS | 🇺🇸 US |
| ✓ Unaffected | Quanta Computer | SERVER ODMs | 🇹🇼 TW |
| ✓ Unaffected | Rapidus | FOUNDRIES | 🇯🇵 JP |
| ✓ Unaffected | Samsung Foundry | FOUNDRIES | 🇰🇷 KR |
| ✓ Unaffected | Samsung Memory | MEMORY (HBM) | 🇰🇷 KR |
| ✓ Unaffected | Samsung Mobile | EDGE DEVICES | 🇰🇷 KR |
| ✓ Unaffected | SCREEN Holdings | EQUIPMENT | 🇯🇵 JP |
| ✓ Unaffected | Shin-Etsu Chemical | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | Shinko Electric | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | SK Hynix | MEMORY (HBM) | 🇰🇷 KR |
| ✓ Unaffected | SMIC | FOUNDRIES | 🇨🇳 CN |
| ✓ Unaffected | SoftBank | CLOUD PROVIDERS | 🇯🇵 JP |
| ✓ Unaffected | SUMCO | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | Sumitomo Chemical | MATERIALS (JAPAN) | 🇯🇵 JP |
| ✓ Unaffected | Super Micro | SERVER ODMs | 🇺🇸 US |
| ✓ Unaffected | Synopsys | EDA TOOLS | 🇺🇸 US |
| ✓ Unaffected | Tokyo Electron | EQUIPMENT | 🇯🇵 JP |
| ✓ Unaffected | TSMC | FOUNDRIES | 🇹🇼 TW |
| ✓ Unaffected | UMC | FOUNDRIES | 🇹🇼 TW |
| ✓ Unaffected | Vertiv | POWER & COOLING | 🇺🇸 US |
| ✓ Unaffected | Wiwynn | SERVER ODMs | 🇹🇼 TW |
| ✓ Unaffected | xAI | AI CONSUMERS | 🇺🇸 US |
| ✓ Unaffected | Xiaomi | EDGE DEVICES | 🇨🇳 CN |
✓ UnaffectedAMD
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedAmkor Technology
OSAT / PACKAGING🇺🇸 US
✓ UnaffectedAnthropic
AI CONSUMERS🇺🇸 US
✓ UnaffectedApple
EDGE DEVICES🇺🇸 US
✓ UnaffectedApplied Materials
EQUIPMENT🇺🇸 US
✓ UnaffectedArista Networks
NETWORKING🇺🇸 US
✓ UnaffectedArm Holdings
CHIP IP🇬🇧 GB
✓ UnaffectedASE Technology
OSAT / PACKAGING🇹🇼 TW
✓ UnaffectedAWS
CLOUD PROVIDERS🇺🇸 US
✓ UnaffectedBiren Technology
CHIP DESIGNERS🇨🇳 CN
✓ UnaffectedBroadcom
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedCadence
EDA TOOLS🇺🇸 US
✓ UnaffectedCambricon
CHIP DESIGNERS🇨🇳 CN
✓ UnaffectedCerebras Systems
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedCisco Systems
NETWORKING🇺🇸 US
✓ UnaffectedCoreWeave
CLOUD PROVIDERS🇺🇸 US
✓ UnaffectedDeepSeek
AI CONSUMERS🇨🇳 CN
✓ UnaffectedDell Technologies
ENTERPRISE🇺🇸 US
✓ UnaffectedEntegris
MATERIALS (JAPAN)🇺🇸 US
✓ UnaffectedFoxconn FII
SERVER ODMs🇹🇼 TW
✓ UnaffectedGlobalFoundries
FOUNDRIES🇺🇸 US
✓ UnaffectedGoogle Cloud
CLOUD PROVIDERS🇺🇸 US
✓ UnaffectedGroq
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedHigh-Purity Quartz (US)
RAW MATERIALS🇺🇸 US
✓ UnaffectedHuawei / HiSilicon
CHIP DESIGNERS🇨🇳 CN
✓ UnaffectedIbiden
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedIntel
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedIntel Foundry
FOUNDRIES🇺🇸 US
✓ UnaffectedJSR Corporation
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedKLA
EQUIPMENT🇺🇸 US
✓ UnaffectedKokusai Electric
EQUIPMENT🇯🇵 JP
✓ UnaffectedLam Research
EQUIPMENT🇺🇸 US
✓ UnaffectedMarvell
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedMediaTek
CHIP DESIGNERS🇹🇼 TW
✓ UnaffectedMeta
AI CONSUMERS🇺🇸 US
✓ UnaffectedMicron
MEMORY (HBM)🇺🇸 US
✓ UnaffectedMicrosoft Azure
CLOUD PROVIDERS🇺🇸 US
✓ UnaffectedMistral AI
AI CONSUMERS🇫🇷 FR
✓ UnaffectedNTT
CLOUD PROVIDERS🇯🇵 JP
✓ UnaffectedNVIDIA
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedOpenAI
AI CONSUMERS🇺🇸 US
✓ UnaffectedOPPO
EDGE DEVICES🇨🇳 CN
✓ UnaffectedOracle Cloud
CLOUD PROVIDERS🇺🇸 US
✓ UnaffectedQualcomm
CHIP DESIGNERS🇺🇸 US
✓ UnaffectedQuanta Computer
SERVER ODMs🇹🇼 TW
✓ UnaffectedRapidus
FOUNDRIES🇯🇵 JP
✓ UnaffectedSamsung Foundry
FOUNDRIES🇰🇷 KR
✓ UnaffectedSamsung Memory
MEMORY (HBM)🇰🇷 KR
✓ UnaffectedSamsung Mobile
EDGE DEVICES🇰🇷 KR
✓ UnaffectedSCREEN Holdings
EQUIPMENT🇯🇵 JP
✓ UnaffectedShin-Etsu Chemical
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedShinko Electric
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedSK Hynix
MEMORY (HBM)🇰🇷 KR
✓ UnaffectedSMIC
FOUNDRIES🇨🇳 CN
✓ UnaffectedSoftBank
CLOUD PROVIDERS🇯🇵 JP
✓ UnaffectedSUMCO
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedSumitomo Chemical
MATERIALS (JAPAN)🇯🇵 JP
✓ UnaffectedSuper Micro
SERVER ODMs🇺🇸 US
✓ UnaffectedSynopsys
EDA TOOLS🇺🇸 US
✓ UnaffectedTokyo Electron
EQUIPMENT🇯🇵 JP
✓ UnaffectedTSMC
FOUNDRIES🇹🇼 TW
✓ UnaffectedUMC
FOUNDRIES🇹🇼 TW
✓ UnaffectedVertiv
POWER & COOLING🇺🇸 US
✓ UnaffectedWiwynn
SERVER ODMs🇹🇼 TW
✓ UnaffectedxAI
AI CONSUMERS🇺🇸 US
✓ UnaffectedXiaomi
EDGE DEVICES🇨🇳 CN
Cascade Timeline
Rule applied
- ✂ Tokyo Electron → SMIC
- ✂ SCREEN Holdings → YMTC
- ✂ Kokusai Electric → YMTC
- ✂ Kokusai Electric → CXMT
Round 1
Cut off · YMTCCut off · CXMTRound 2
At risk · Alibaba CloudAt risk · Tencent CloudAt risk · BaiduAt risk · ByteDanceAt risk · Huawei Cloud
EXPLORE FREE-FORM
Add one or more restricting and target countries, then re-run the cascade.
Restricting country
→🇯🇵 Japan
Target country
🇨🇳 China